“Coverity solved all the problems for static analysis, along with providing a centralized database. It has a great reporting system, and for anybody from a program manager to product manager to development manager, the ability to manage all these things in a single place is key. While there are numerous …

"The combination of DC Ultra and Formality has helped us achieve our aggressive timing and area goals and create designs that are fully verifiable. Formality has shaved weeks off our schedules and helped us tapeout our chips with confidence."

"With Synopsys Cloud, we are able to access a complete end-to-end chip design environment offering industry-leading EDA tools and silicon-proven IP. Access to pre-configured and end-to-end design flows improved productivity for our global team, helping us to accelerate our time to market while ensuring performance and reliability requirements were met."

"Synopsys SLM High-Speed Access & Test IP allowed us to conduct scan test over a functional interface. This enabled running scan test through the entire silicon lifecycle including—Wafer Sort, Final Test, System-Level Test, and In-System Test."

"We have made IoT security the utmost priority with Longview throughout the entire solution, from our sensors to the cloud and into the field. Working with GlobalSign and their partner Synopsys ensures that businesses and users are protected by best-in-class technologies at every point in the system, ensuring that our …

“Our technology integration with Synopsys takes security to the next level, particularly when dealing with high-risk assets included in the eFPGA for obfuscation.”

“Synopsys Software-based PUF allows our customers to protect their assets from being stolen or cloned during manufacturing, and provide authentication and encryption functions for edge-to-cloud applications."

"Synopsys Cloud delivered enormous compute and EDA tool scalability to accelerate library characterization using Synopsys PrimeLib. These resources were deployed rapidly, reducing the schedule for re-characterization from 3 months to 1 month.”

"Just like our AIM technology that focuses on the highest AI precision with dependability, throughput, and efficiency, Synopsys Cloud provides the most dependable, productive, and complete EDA SaaS environment for designing chips.”

"One of our challenges from the start was bringing team members up to speed to meet our tape-out requirements. The Synopsys sales, technical support, and R&D teams worked together to help us become familiar with the platform. We are fully convinced Synopsys Cloud offers an excellent platform to develop our …

"TetraMem’s analog-RRAM–based in-memory computing technology, inspired by the human brain, changes the paradigm of how AI computations are performed, launching new possibilities for AI everywhere. Designing for a radically different system requires reliable, robust, and flexible engineering tools and collaboration across global working sites. Synopsys Cloud has played a pivotal …

“We were able to achieve a very fast infrastructure setup on the Synopsys Cloud EDA environment within days. The vast selection of EDA tools and IP available on the cloud enabled us to start the design, verification, and backend flow very quickly. The flexibility of using as many licenses as …

"We are creating the world’s most efficient AI accelerator chip, built around a RISC-V architecture and powered by our novel analog in-memory computing technology. Developing and integrating these elements requires a wellengineered platform to support an iterative and flexible design process in order to meet performance objectives with quality. With …

“TetraMem Inc used Synopsys’ responsive worldwide support team during the engagement. One of our challenges from the start was bringing global team members up to speed to meet our product specifications and time-to-market goals. The Synopsys sales, technical support, and R&D teams worked together to help us become familiar with …

"With the unified database connected to the Synopsys Digital Design Family, Synopsys 3DIC Compiler, which is qualified for our multi-die system integration process flow down to 2nm and supports our I-Cube and X-Cube technologies, provides a scalable and efficient exploration-to-signoff platform for multi-die systems."