"The idea is to move the interconnects from the front panel directly into the same package, reducing the cost of the electronics. In this way, you simplify all the conditioning electronics, you reduce power consumption, and you reduce signal loss. You can also increase the bandwidth density per square centimeter. So, in the same footprint, you can have more optical I/O ports at higher speed.”
“What they’ve done is unique in terms of the level of integration and WDM. How they did the implementation, getting the chiplet so small, comes from the Ayar Labs proprietary technology for the modulators and detectors, which are quite tightly packed compared with traditional Mach-Zehnder modulators.”