Ayar Labs Testimonials

"The idea is to move the interconnects from the front panel directly into the same package, reducing the cost of the electronics. In this way, you simplify all the conditioning electronics, you reduce power consumption, and you reduce signal loss. You can also increase the bandwidth density per square centimeter. So, in the same footprint, you can have more optical I/O ports at higher speed.”

“Today, we know what technologies are necessary for the first and second generation of Exascale platforms in the 2022 to 2023 timeframe, but after that a crossover to optical I/O based solutions will be needed.”